Forge Nano Wafer Coating
APOLLO Commercial Scale Wafer Coating
Model:
Performance
APOLLO provides fully automatic cassette-to-cassette ALD processes with high throughput performance at the lowest cost of ownership. APOLLO leads in every aspect of ALD productivity, performance and cost, and sets a new standard for efficiency while reducing environmental impact. With its ‘zero-waste’ processing, APOLLO lowers factory power consumption and occupies a smaller footprint on the clean-room floor.
High Throughput Wafer Coating System
The APOLLO system product line sets new benchmarks in atomic layer deposition productivity and cost effectiveness. Designed for high volume semiconductor wafer-based production, our Semi-S2 certified APOLL systems integrate the high productivity of SMFD-ALD with a revolutionary simple substrate handling. The result is a flexible, modular system that can be easily configured to our customers’ needs.
APOLLO provides fully automatic cassette-to-cassette ALD processes with high throughput performance at the lowest cost of ownership. APOLLO leads in every aspect of ALD productivity, performance and cost, and sets a new standard for efficiency while reducing environmental impact. With its ‘zero-waste’ processing, APOLLO lowers factory power consumption and occupies a smaller footprint on the clean-room floor.
High Throughput Wafer Coating System
The APOLLO system product line sets new benchmarks in atomic layer deposition productivity and cost effectiveness. Designed for high volume semiconductor wafer-based production, our Semi-S2 certified APOLL systems integrate the high productivity of SMFD-ALD with a revolutionary simple substrate handling. The result is a flexible, modular system that can be easily configured to our customers’ needs.
- Thick film deposition ( >1 micron)
- Short ALD cycle times (0.4-1 sec)
- Low temperature processing (down to 80 °C)
- 100% conformal films over any substrate topology
- Seamless incorporation of nano-laminates with reproducible atomic-layer control
- Composite ternary and quaternary alloy films with no throughput penalty
Specifications
- Temperature Window: 50 – 500 °C
- Liquid Chemical Inlets: Up to 8
- Gaseous Chemical Inlets: Up to 4
- Footprint: 66″ L x 46″ W x 80″ H
- Capacity: Up to 200mm wafers
- Substrate Handling: Automated dual cassette
