Commercial Scale Atomic Layer Deposition On Objects

Chemistries:

Cost-effective ALD of films including ZrO2, Al2O3, ZnO, ZnAlO, ZnBO, SiO2, TiO2, TiAlO, TiN, BN, Nb3N5 and more. Seamless and reproducible film engineering with nanolaminate and nanocomposite capabilities, adhesion in excess of 1000 PSI to many different substrates including tin, gold, copper, FR4, polyimides, many different solder mask materials, polyurethanes, ceramics, adhesives and more.

Applications:

• Electronic devices
• Sensors and OLED displays
• PCBs, CoBs, ICs and modules
• Medical devices and sensors
• Optical coatings
• Display and solar technology
• Photo-catalytic coatings
• Encapsulation for environmental, corrosion, and high voltage insulation

Design:

HELIOS accommodates parts with many different shapes and sizes with the combination of modular, parts-specific tooling and a generic loader. Standard chamber size from 1.5-80 liters or up to 1m X 1m panels (custom sizes available).