The first MIT IR Assisted bonding with real Light-Radiation process

The Rapid、Precision & Stabilization of automatic temperature control system
* Development of advanced bonding technology for Multi-Chip Package and SiP
* Suitability for Heterogeneous Materials with Wide range of heating control
* The best choose of thermal process for Solder-Joint with High Throughput(UPH) and Low Warpage Solution

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