Semiconductor & Package

Fastmicro: Surface particle measurements at microscale Fastmicro was founded in 2019 in Geldrop, after 15 year of research and development based on technology co-developed with research institute TNO.

AOI glue inspection machine: semiconductor packaging process FLUX and Underfill glue optical inspection equipment, which can measure glue width, glue overflow, glue shortage, glue creep and other related conditions

Eshylon's new, patented Mobile Electrostatic Carrier (MESC) platform enables leading-edge device fabrication by providing a rigid but mobile platform for handling challenging substrates in an R&D, pilot line or high volume manufacturing environment.

MR FIB Mask Repair Tool is developed for repairing defects on photomasks and reticles for semiconductor devices and LCD devices. This system can repair extremely small and complicatedly shaped defects on photomasks, such as phase shift masks and binary masks, with high accuracy.

IRAB uses a variety of exclusive control technologies-even in the advanced assembly process (Reflow) of various composite materials, it can still easily achieve fast and accurate bonding!

Like you we are striving for the best Rapid Thermal Processing solution. This solution translates into our unique concept based on fast heating via conduction rather than the conventional method of radiation, improving the thermal budget.