Semiconductor & Package

AOI glue inspection machine: semiconductor packaging process FLUX and Underfill glue optical inspection equipment, which can measure glue width, glue overflow, glue shortage, glue creep and other related conditions

SASIC Corporation is a chemical company producing unique solutions intended for the advanced IC industry. SASICs products are not a mere variation on existing products, but are entirely new solutions for problems facing the semiconductor industry.

Eshylon's new, patented Mobile Electrostatic Carrier (MESC) platform enables leading-edge device fabrication by providing a rigid but mobile platform for handling challenging substrates in an R&D, pilot line or high volume manufacturing environment.

MR FIB Mask Repair Tool is developed for repairing defects on photomasks and reticles for semiconductor devices and LCD devices. This system can repair extremely small and complicatedly shaped defects on photomasks, such as phase shift masks and binary masks, with high accuracy.

IRAB uses a variety of exclusive control technologies-even in the advanced assembly process (Reflow) of various composite materials, it can still easily achieve fast and accurate bonding!

The KoCoS Technology Group is a group of companies with a global presence which develops, manufactures and sells measuring and test systems for equipment in electricity supply systems and laser-optical inspection systems for quality monitoring.