Semiconductor & Package

Development, manufacturing, and sales of factory automation equipment Development, manufacturing, and sales of semiconductor high-precision mounting equipment Development, manufacturing, and sales of board mounting equipment Development, manufacturing, and sales of printed board inspection equipment Development, sales, and maintenance services for IC card management software

Device Dynamics Lab focuses on developing a worldwide first platform that can quantitatively characterize trapping induced instability and degradation of GaN-based devices, providing the essential information for advancing GaN technology.

Forge Nano is a world-leading materials science company. Harnessing the power of Atomic Armor, our proprietary nanocoating technology, we accelerate manufacturing innovation and transform product performance to achieve a more sustainable future.

HELIOS coating systems bring film quality, atomic-level control and conformal performance of ALD to industrial manufacturing, opening up new possibilities and enabling novel applications as protective of functional surface engineered objects.

Forge Nano Equipment precisely applies ALD onto Semiconductor wafers and components.

AOI glue inspection machine: semiconductor packaging process FLUX and Underfill glue optical inspection equipment, which can measure glue width, glue overflow, glue shortage, glue creep and other related conditions