BENEFITS
  • The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24&rdquo by 18.
  • Oxygen service vacuum pump and booster is equipped with a two point purge system to minimize any corrosive end products forming in the pump thereby extending the service life while lowering maintenance costs.
  • Modify or custom build a system to meet your specific needs including RIE (Reactive Ion Etching).   
 
SYSTEM FEATURES
  • 6, 8, 12, 16 and 24 Horizontal &ldquoShelf&rdquo Systems available
  • Each shelf is 24&rdquo x 18&rdquo on 1.5&rdquo Spacing
  • R.F. Generator & Automatic Matching Network 1250 to 5000 Watts @ 13.56MHz
  • Electrostatic Shielding of chamber to promote uniformity
  • Process Temperature Control 1250 F to 3000 F to eliminate a warm up cycle
  • Two Mass Flow Controllers, 0-2000 SCCM
  • Low gas supply pressure alarms on process and purge gas
  • MKS 0-10 Torr Capacitance Vacuum Gauge
  • Microprocessor Control System w/ Touch Screen interface
  • Multiple (up to 3 stage) Recipe Storage
  • Edwards Oxygen Service Vacuum Pump | Edwards Roots style Booster Blower
  • 3 Micron Vacuum Pump Oil Filtration
  • Two point Automatic N2 Purging of the Vacuum Pump
  • Oil Mist Coalescing Filter on the Vacuum pump&rsquos exhaust
  • Windows Computer Control System w/ Touch Screen Interface
  • Data Recording, Reporting w/Event Viewing and printing
  • Signal Light Tower | Edwards GV80 Dry Vacuum Pump
  • MKS Automatic Throttle Vacuum Controller | Up to 4 Mass Flow Controllers
  • Process controlled Gas steering matrix 5 gas inputs through 2 or 3 MFC&rsquos
  • Controlled Rate N2 Chamber Purging | Custom Chamber sizes and configurations
  • Custom Electrode sizes and configurations
 
APPLICATIONS
  • PCB Via Etch/Desmear/EtchBack/Descum