PE Plasma Clean Etch Equipment
PE200 Plasma Etch Model
Model:
The PE-200 is our industrial strength bench top system and supplied with an oxygen service vacuum pump. This robust, reliable and yet quite affordable system was developed for the busy 24/7 manufacturing firm that cannot have downtime.Etching in our plasma system rather than with chemical baths can eliminate expensive hazardous chemical waste. Our simple to use, intuitive touch screen interface controls every aspect of the plasma process ensuring repeatability...
BENEFITS
- Customize chamber, electrode, RIE (Reactive Ion Etch) and Semiconductor Lead Frame magazines
- Our welded aluminum vacuum chamber encloses a generous 500 square inches of active plasma processing surface.
- Welded Aluminum Vacuum Chamber, 17&rdquo wide x 17&rdquo deep x 14&rdquo high
- 3 Horizontal processing Electrode Levels 13&rdquo wide x 16&rdquo deep on 3&rdquo spacing
- 300 Watt R.F. Generator @ 13.56 MHz | Automatic Matching Network
- One 200 SCCM Mass Flow Controller | Pirani Vacuum Gauge 0-1 Torr
- Microprocessor Control System w/Touch Screen interface
- Stores up to 20 two step recipes | 29 CFM Oxygen Service Vacuum Pump
- 3 Microns Vacuum Pump Oil Filtration
- 3Electrostatic Shielding | Process Temperature Control
- 600 W RF Generator @ 13.56MHz | 600W Automatic Matching Network
- 59 CFM Vacuum oxygen service vacuum pump (3 phase)
- Automatic 2 point N2 purge system for vacuum pump longevity
- Signal Light Tower | MKS Automatic Throttle Vacuum Controller
- 2 additional Mass Flow Controllers (total of 3)
- Software able 5 process gas input steering matrix
- Controlled Rate N2 Chamber Purge
- Oil Mist Coalescing Filter on Vacuum pump exhaust
- Custom Chamber size and configuration
- Custom Electrode Size and configuration
- RIE (reactive ion electrode) Configuration
- Plasma sterilization
- Surface modification