TEPHRA (200 mm Cluster Platform)
advanced 3D integration and More-than-Moore device manufacturing on 200 mm
wafers and below. TEPHRA utilizes Forge Nano’s ALDx technology, delivering
unprecedented throughput to a single-wafer ALD tool without compromising on
efficiency, performance or yield.
TEPHRA™ tools will be an industry-informed Cluster System design aimed at maximum ALD productivity with new automation and controls.
Cluster System Design
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Transfer and cassette modules are off-the-shelf 3rd party with a long track record of reliability in semiconductor
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Designed to handle various substrates from 100mm to 200mm Ø
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Up to 3 Process Modules
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Dedicated for specific ALD processes
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Oxides, Nitrides, Metals
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Preheat – coming soon
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Plasma Clean – coming soon
Materials
Oxides: Al₂O₃, SiO₂, HfO₂, ZrO₂, Ta₂O₅, AZO, TiO₂, Y₂O₃
Nitrides: TiN, TaN, AlN, GaN, ZrN
Elements: Ru, Pt, Co, Cu, Ni
Applications: Moisture Barriers, Passivation, Seed Layers, Copper Barriers, Optical Coatings, TCOs
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Hardware
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Fast pneumatic valves (1 msec actuation)
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In situ pressure regime control capable of sub 1 sec cycle times
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Front-end cassette handling with load lock and robotic transfer module
Process
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Dedicated chambers for oxides, nitrides and elements
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Catalyzed thermal ALD processing eliminates need for plasma
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Up to 90% precursor utilization for selected processes
Control
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Modular PLC system
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SECS/GEM compliance with expanded data logging
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E95 compliant graphical HMI
