ALPHA DESIGN - Die Bonder
High Precision Die Bonder- HSDB-200-C
型號:
1. HSDB-200C enables to mount a chip to substrate with high speed and accuracy.
2. HSDB-200C achieves placement accuracy with ± 5 μ m or less
3. HSDB-200C has a head self-weight cancel mechanism and performs steady and delicate load position control.
4. HSDB-200C has a function to detects height of a substrate, and automatically corrects the lowering volume of Z axis.
5. The automatic measurement function of placement accuracy is available (optional).
6. HSDB-200C has 360°rotation pickup tool and this enable the machine to manipulate broad range of sticking methods
of chips and mounting method.
2. HSDB-200C achieves placement accuracy with ± 5 μ m or less
3. HSDB-200C has a head self-weight cancel mechanism and performs steady and delicate load position control.
4. HSDB-200C has a function to detects height of a substrate, and automatically corrects the lowering volume of Z axis.
5. The automatic measurement function of placement accuracy is available (optional).
6. HSDB-200C has 360°rotation pickup tool and this enable the machine to manipulate broad range of sticking methods
of chips and mounting method.
Pick up /push out (ejector) section
Chip recognition camera and the mounting stage